学术报告：印刷电子学—材料和加工领域十年进展

报告人：Prof. Beng Ong（王明顺）

联系人：龙孟秋

时间：2017-3-19 （周日） 上午 10.00-11:30

地点：双超所211报告室

欢迎本科生、研究生和教师参加！

报告人简介：Prof. Beng Ong（王明顺教授）目前是香港浸会大学有机电子科学卓越研究中心主任，创意学院副主任，化学系材料科学讲座教授。

Abstract

The interest in printed electronics has exploded over the last decade owing to its

potential for creating novel impactful large‐area, lightweight, flexible, and low‐cost

electronics. To realize this technology vision, manufacture of semiconductor devices

by high‐throughput roll‐to‐roll printing, instead of slow, batch‐wise photolithographic

processes, would be paramount. Printed electronics offers a low‐cost

and eco‐friendlier manufacturing approach to a wide spectrum of semiconductor

devices including next‐gen displays, ultra‐low‐cost RFIDs, smart labels and

packaging, sensors and images, etc. Foremost among critical enablers to propel this

paradigm shift in manufacturing is a performance‐fulfilling materials suite and

compatible processes for fabricating functionally‐capable transistors – the

fundamental building blocks of modern microelectronics. This presentation

discusses the issues, challenges, and advances in materials and process

development for printed electronics over the last decade and the outlook for this

emerging technology moving forward. It aims to shed light on whether this

emerging technology is all fantasy and hypes or innovations and opportunities of

impactful commercial values for our times and beyond.